Reliability of High-Power IGBT Modules for Traction Applications

作者: Mauro Ciappa , Alberto Castellazzi

DOI: 10.1109/RELPHY.2007.369938

关键词: Power semiconductor deviceThermal management of electronic devices and systemsTraction (engineering)Automotive engineeringInsulated-gate bipolar transistorElectronic engineeringEngineeringElectromagnetic simulation

摘要: The enhancement of the system efficiency in conjunction with a reduction weight and volume transportation applications requires high temperature power devices reduced losses an optimized thermal management. This paper addresses main technology issues some recently-developed design tools to be considered order reach imposed reliability level.

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