Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

摘要: Abstract This paper is focused on the effect of TiC nano-reinforcement that was successfully introduced into a SAC305 lead-free solder alloy with different weight fractions (0, 0.05, 0.1 and 0.2 wt%) through powder-metallurgy route. Actual retained ratios reinforcement in composite billets joints were quantitatively analysed. The obtained SAC/TiC solders also studied extensively regard to their coefficient thermal expansion (CTE), wettability properties. In addition, evolution interfacial intermetallic compounds (IMCs) corresponding changes mechanical properties under ageing investigated. Only about 10%–30% initial nanoparticles added found final joints. With an appropriate addition amount nanoparticles, exhibited improvement wettability. A negligible change melting point widened range containing reinforcement. Also, CTE alloys effectively decreased when compared plain SAC alloy. growth IMCs notably suppressed isothermal condition, while significantly outperformed those non-reinforced throughout period.