Interconnect structure and method
作者： Po-Cheng Shih , Chung-Chi Ko , Chih-Chien Chi , Chia-Cheng Chou , Jun-Yi Ruan
DOI:
关键词: Process (computing) 、 Dielectric 、 Materials science 、 Layer (electronics) 、 Insert (composites) 、 Conductive materials 、 Interconnection 、 Bending 、 Composite number 、 Composite material
摘要: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The may be applied between two Once formed, trenches vias formed within the composite layers, will help that limit or eliminate undesired bending other structural motions could hamper subsequent process steps, such as filling with conductive material.
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