作者: Jean-Claude Ramirez
DOI: 10.1016/0020-7683(89)90026-7
关键词: Materials science 、 Plastic film 、 Linear elasticity 、 Instability 、 Bifurcation 、 Composite material 、 Deformation (engineering) 、 Substrate (electronics) 、 Thin film 、 Stress (mechanics) 、 Optics
摘要: Abstract A model is constructed of a thin film rigid-plastic material bonded to linear elastic substrate subject state mismatch strain between the two materials. The purpose study investigate existence deformation localization in that periodic along direction bi-material interface. Bifurcation phenomena could be possible precursor debonding phenomena. conditions necessary for these undulations appear are given by bifurcation equation which relates internal stress relative stiffness and thickness film.