作者: Wayne K. Morrow , Stephen J. Pearton , Fan Ren
关键词: Diffusion barrier 、 Carbide 、 Graphene oxide paper 、 Atomic diffusion 、 Graphene 、 Nanotechnology 、 Electrical contacts 、 Materials science 、 Microelectronics 、 Metal
摘要: … as a cladding layer to prevent Cu mass transport into silicon, … , a 15-layer, 5 nm MLG stack was utilized to test its effects on … Ta/Si/Ti/Al/Ni/Ta, all of which can achieve contact resistances …