Substrate Processing Apparatus and Temperature Control Device
作者： Toshihisa Nozawa , Koji Kotani
DOI:
关键词: Flow (psychology) 、 Air cooling 、 Water cooling 、 Thermodynamics 、 Chemistry 、 Chiller 、 Mechanics 、 Temperature control 、 Substrate (building)
摘要: A first flow passage (16), which cools a temperature controlled object by circulating cooling water (15), and second (19) separate from the are provided so as to exchange heat between (18) flowing through (15). There is no need store (15) in tank of constant capacity, (16) chiller corresponding part absorbed substantially its entirety (18). response becomes quick with respect load fluctuation object, waste energy can be reduced while improving accuracy control.
lens.org 参考文章(14)
Noriaki Matsushima, Hirofumi Kitayama, Conductor treating single-wafer type treating device and method for semi-conductor treating ,(2001)
Kanichi Kadotani, Multi-temperature control system and fluid temperature control device applicable to the same system ,(1996)
Kenneth S. Collins, Michael Rice, Edwin C. Weldon, Ananda H. Kumar, Shamouil Shamouilian, Eric Farahmand E Askarinam, Kadthala R. Narendrnath, Process chamber having improved temperature control ,(1998)
Thomas Kailath, Charles D. Schaper, Khalid A. El-Awady, Multizone bake/chill thermal cycling module ,(1997)
Eric J. Strang, Wayne L. Johnson, Apparatus for active temperature control of susceptors ,(2005)
Cha-young Yoo, Young-sun Kim, Young-wook Park, Seung-hee Nam, Apparatus for fabricating polysilicon film for semiconductor device ,(1997)
Eric Lee Gaylord, Charles Herman Mueller, Cooling system and method for epitaxial barrel reactor ,(1996)
利之 亀井, Toshiyuki Kamei, Controller for fluid temperature and its control method ,(1997)
Naohisa Asaka, Temperature adjustment mechanism of work reaction device ,(1994)
Kanichi Kadotani, ▲かん▼一 門谷, Multi-temperature control system and reaction processor to which same is applied ,(1996)