Color solid-state image sensor
作者： Yukio Endo , Okio Yoshida , Nozomu Harada
DOI:
关键词: Optics 、 Color image 、 Layer (electronics) 、 Materials science 、 Signal 、 Optoelectronics 、 Pixel 、 Color gel 、 Substrate (printing) 、 Color solid 、 Image sensor
摘要: A stacked type color solid-state image sensor in which a photoconductive film is formed evenly on substrate having matrix array of picture element cells and wiring pattern including bonding pad pattern. The functions as an optoelectro-transducing section for the cells. filter layer such that it positioned above cell area. contact hole after has been formed. Since to cover whole surface area substrate, even when over film. Thus, uniform, homogeneous surface. degeneration signal due uneven can be prevented by ingenious manufacturing design.
lens.org 参考文章(7)
T. Chikamura, Y. Miyata, K. Yano, Y. Ohta, S. Fujiwara, Y. Terui, M. Yoshino, M. Nakayama, M. Fukai, A CCD imager overlaid with a thin-film photodetector of a heterojunction ZnSe-Zn 1-x Cd x Te IEEE Transactions on Electron Devices. ,vol. 30, pp. 1386- 1391 ,(1983) , 10.1109/T-ED.1983.21304
Nozomu Harada, Yoshiaki Komatsubara, Method of manufacturing a solid-state image pickup device ,(1984)
Akira Sasano, Toru Baji, Toshihisa Tsukada, Norio Koike, Color solid-state imager ,(1982)
Takashige Tamamushi, Sohbe Suzuki, Jun-ichi Nishizawa, Masaharu Imai, Solid state image pick-up device ,(1983)
Yasuo Takemura, Solid-state image pick-up device ,(1980)