Integrated circuit packaging system with terminals and method of manufacture thereof
作者： Linda Pei Ee Chua , Arnel Senosa Trasporto , Byung Tai Do
DOI:
关键词: Materials science 、 Electronic engineering 、 Integrated circuit packaging 、 Encapsulation (networking) 、 Integrated circuit 、 Mechanical engineering
摘要: A method of manufacture an integrated circuit packaging system includes: providing a leadframe having mounting platform; applying attach layer on the die layer; forming encapsulation and layer, platform exposed from encapsulation; terminal protrusion leadframe, below horizontal plane platform.
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