Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same
作者： Christopher E. Jones , Merrill A. Hatcher , Martin P. Goetz
DOI:
关键词: Substrate (printing) 、 Adhesive 、 Pyroelectricity 、 Void (composites) 、 Optoelectronics 、 Electrically conductive 、 Materials science 、 Electrical engineering
摘要: A hermetic package for a pyroelectric-sensitive electronic device and methods of manufacturing one or more such packages. In embodiment, the includes: (1) substrate having: (1a) an active region containing electrically conductive pattern that constitutes at least portion (1b) bonding surrounding region, (2) non-porous mounting having thereon (3) nonmetallic sealing adhesive, located between substrate, cures temperature substantially below pyroelectric sensitive device, proximate void substrate.
lens.org 参考文章(22)
Maurice S. Karpman, Semiconductor device having a low temperature uv-cured epoxy seal ,(1990)
Osamu Furukawa, Kenichi Donuma, Kazuhisa Yabukawa, Hitoshi Chiyoma, Electronic component and method of production thereof ,(1996)
Shun-ichi Seki, Kazuo Eda, Keiji Onishi, Yutaka Taguchi, Surface acoustic wave device with interdigital transducers formed on a holding substrate thereof and a method of producing the same ,(1993)
Ronald L Hinds, Flip chip package for micromachined semiconductors ,(2000)
Brian M. Mancini, Thomas A. Knecht, Joseph P. Krause, Sealed electronic package providing in-situ metallization ,(1992)
K. Eda, Y. Tomita, M. Sugimoto, T. Ogura, A. Nanba, Y. Taguchi, O. Kawasaki, Direct bonding of piezoelectric materials onto Si international symposium on applications of ferroelectrics. ,vol. 2, pp. 719- 722 ,(1996) , 10.1109/ISAF.1996.598125
William Chi-Keung Tang, David G. McIntyre, Xia Zhang, Fabrication method for encapsulated micromachined structures ,(1997)
H. Takagi, Ryutaro Maeda, N. Hosoda, Tadatomo Suga, Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation Materials Science Forum. ,vol. 294-296, pp. 341- 344 ,(1998) , 10.4028/WWW.SCIENTIFIC.NET/MSF.294-296.341
O. Kawasaki, M. Sugimoto, K. Takeda, T. Ohtsuchi, Y. Tomita, Even-order thickness-shear mode resonators using X-cut LiTaO/sub 3/ plates realized by a direct bonding technique internaltional ultrasonics symposium. ,vol. 1, pp. 919- 923 ,(1998) , 10.1109/ULTSYM.1998.762293
Matthew M. Salatino, William R. Young, Patrick A. Begley, Lid wafer bond packaging and micromachining ,(1997)