作者: Jared M. Hornberger , Edgar Cilio , Brice McPherson , Roberto M. Schupbach , Alexander B. Lostetter
DOI: 10.1109/PESC.2007.4342136
关键词: Inverter 、 Silicon carbide 、 Motor drive 、 Electronic packaging 、 Power semiconductor device 、 Silicon on insulator 、 Materials science 、 Electrical engineering 、 Power electronics 、 Power module
摘要: The researchers have designed, developed, packaged, and manufactured a complete multichip power module (MCPM) that integrates silicon carbide (SiC) transistors with on insulator (SOI) control electronics. SiC MCPM approach targets the reduction of size increase in efficiency electronic systems resulting highly miniaturized, high density module. previously presented single phase 3 kW inverter was also proven operational to 250degC at 500 W. In this paper APEI, Inc. will present new three-phase has been fully tested 4 300degC operation. paper, discuss challenges associated high-temperature operation electronics, including electrical, mechanical, thermal design. Many packaging problems solved enable these modules. These issues be discussed as well remaining still need advancing. Finally, full temperature (300degC kW) test results are presented.