作者: Yuvaraj Dora , Sooyeon Han , Dmitri Klenov , Peter J. Hansen , Kwang-soo No
DOI: 10.1116/1.2167991
关键词: Passivation 、 Materials science 、 Permittivity 、 Wide-bandgap semiconductor 、 Optoelectronics 、 Dielectric 、 Field-effect transistor 、 High-electron-mobility transistor 、 Gate dielectric 、 Sapphire
摘要: We investigated the suitability of ZrO2 as a high-k dielectric for GaN material systems. Thin Zr films (4nm) were deposited by electron-beam evaporation at room temperature on n-type and Al0.22Ga0.78N(29nm)∕GaN high electron mobility transistor (HEMT) structures. The Zr-coated samples subsequently oxidized temperatures in range 200–400 °C an ozone environment. Atomic force microscopy studies after oxidation show that forms conformal layer underlying template. Cross-section transmission showed little intermixing with AlGaN∕GaN. relative constant was determined to be 23. In comparison HEMTs bare gates (no between gate metal AlGaN), two three order magnitude reduction leakage current. Optimization HEMT process sapphire substrates under yielded devices powers 3.8W∕mm 58% power-added eff...