Structure for contact formation using a silicon-germanium alloy

作者: Randhir P. S. Thakur

DOI:

关键词: AlloySiliconMetallurgySilicon-germaniumDopingGermaniumMaterials scienceOptoelectronicsContact formationAnnealing (metallurgy)Electrical resistivity and conductivity

摘要: A new method and structure for an improved contact using doped silicon is provided. The structures are integrated into several higher level embodiments. has low resistivity. Improved junctions thus provided between IGFET device subsequent metallization layers. improvements obtained through the use of a silicon-germanium (Si—Ge) alloy. alloy can be formed from depositing germanium onto substrate subsequently annealing or by selectively preformed opening. above advantages incorporated with relatively few process steps.

参考文章(15)
Stanford R. Ovshinsky, Wolodymyr Czubatyj, Stephen J. Hudgens, David A. Strand, Qiuyi Ye, Jesus Gonzalez-Hernandez, Hellmut Fritzsche, Benjamin S. Chao, Sergey A. Kostylev, Homogeneous compositions of microcrystalline semiconductor material, semiconductor devices and directly overwritable memory elements fabricated therefrom, and arrays fabricated from the memory elements ,(1991)
Emel S. Bulat, Marvin J. Tabasky, Junction field effect transistor with SiGe contact regions ,(1990)
Mahesh K. Sanganeria, Douglas T. Grider, Mehmet C. Ozturk, Stanton P. Ashburn, Selective deposition of doped silion-germanium alloy on semiconductor substrate ,(1992)
V. Aubry, F. Meyer, P. Warren, D. Dutartre, Schottky barrier heights of W on Si1−xGex alloys Applied Physics Letters. ,vol. 63, pp. 2520- 2522 ,(1993) , 10.1063/1.110468
Carole Craig Barron, Yasuhito Shiho, Method of forming embedded DRAM structure ,(1999)