Method for forming multi-layered interconnect structure
作者： Akira Matsumoto
DOI:
关键词: Interconnection 、 Electronic engineering 、 Spark plug 、 Composite material 、 Dielectric 、 Electrical conductor 、 Materials science 、 Etching (microfabrication)
摘要: A method for forming a multi-layered interconnect structure including an underlying interconnect, overlying and conductive via-plug connecting the both interconnects, wherein through-hole is filled with protective film plug, during etching of top surface plug in placed lower than second dielectric film. In accordance present invention, having smaller connection resistance dimensions can be obtained.
lens.org 参考文章(11)
Kumar D. Puntambekar, Method for depositing double nitride layer in semiconductor processing ,(1996)
Cheng-Tung Lin, Jenn Ming Huang, Yu-Hua Lee, Cheng-Ming Wu, Robust dual damascene process ,(1998)
James K. Kai, Bhanwar Singh, Fei Wang, Dual damascene process using sacrificial spin-on materials ,(2000)
Subhash Gupta, Rich Klein, Ming-Ren Lin, Steven Avanzino, Scott D. Luning, Dual damascene with a sacrificial via fill ,(1995)
Kuk-Han Yoon, Woo-Sung Cho, Jae-Hyun Park, Jae-Hee Ha, Jin-Won Park, High aspect ratio via etching for dual damascene process in a inductively coupled plasma (ICP) etcher international conference on vlsi and cad. pp. 155- 158 ,(1999) , 10.1109/ICVC.1999.820857
Ming-Ren Lin, Mark Chang, Richard J. Huang, Robin Cheung, Angela Hui, Simplified dual damascene process for multilevel metallization and interconnection structure ,(1995)
Chan-Lon Yang, Tong-Yu Chen, Method of patterning a dual damascene ,(2000)
Anthony Yen, Syun-Ming Jang, Hung-Chang Hsieh, Dual damascene method employing sacrificial via fill layer ,(1999)
Yasumitsu Taira, Masakazu Kobayashi, Etsuko Iguchi, Electric wiring forming method with use of embedding material ,(1999)
Serge Vanhaelemeersch, Bart Coenegrachts, Herbert Struyf, Joost Waeterloos, Karen Maex, Heike Thompson, Roger Palmans, Iwan Vervoort, Lynn Forester, Annemie Van Ammel, Gerald Beyer, Dry etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma ,(1999)