Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating
作者： Liu Yang , Aleksandar Radisic , Johan Deconinck , Philippe M. Vereecken
DOI: 10.1149/2.072405JES
关键词: Horizontal scan rate 、 Polyethylene glycol 、 Desorption 、 Hysteresis 、 Current density 、 Materials science 、 Copper plating 、 Chemical engineering 、 Electroplating 、 Adsorption
摘要: The desorption / adsorption of suppressor additive during Cu electroplating plays a critical role in the void-free filling recessed features such as through-silicon vias (TSVs) used 3-dimensional integration. A stochastic model was proposed for Polyethylene Glycol (PEG) electroplating. Using model, program capable simulating transient processes cyclic voltammograms (CVs) developed. steep change current density due to desorption, well characteristic hysteresis, observed CVs shown simulation. dependency PEG on various factors, including bath composition, scan rate and molecular weight, simulated. simulation results were confronted side-by-side with corresponding experimental measurements. An overall good qualitative match shown.
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