The Limitation and Optimization of Bottom-Up Growth Mode in Through Silicon Via Electroplating
作者： Liu Yang , Aleksandar Radisic , Johan Deconinck , Philippe Vereecken
DOI: 10.1149/2.0771512JES
关键词: Optoelectronics 、 Mode (statistics) 、 Electroplating 、 Through-silicon via 、 Materials science
摘要:
core.ac.uk
ecsdl.org参考文章(26)
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