Design for packageability-the impact of bonding technology on the size and layout of VLSI dies
作者： P. Dehkordi , D.W. Bouldin
关键词: Electronic circuit 、 Die (manufacturing) 、 Energy consumption 、 Lead bonding 、 Integrated circuit design 、 Very-large-scale integration 、 Engineering 、 Electronic engineering 、 Point (geometry)
摘要: The impact of bonding technology from an IC designer's point view is studied. Work by others has concentrated just on the effect packaging alone, whereas this study investigates changing VLSI dies. Specifically, wire-bond and flip-chip technologies size layout dies demonstrated means general discussion detailed examples. Three chips various sizes I/O requirements have been synthesized based a standard-cell library for both flip-chip. results show different die layouts can be achieved choice or technologies. >
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