Method of producing an electronic component with flexible bonding pads
作者： Alfred Haimerl , Harry Hedler
DOI:
关键词: Thermal conduction 、 Engineering 、 Electrical engineering 、 Electrical contacts 、 Electrical bonding 、 Electronic circuit 、 Optoelectronics 、 Electronic component
摘要: A method for producing an electronic component with circuit and electrical contacts, disposed at least on a first surface of the component, bonding includes one flexible elevation insulating material surface, contact elevation, conduction path or in interior between circuit.
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