Reliability analysis of conductive adhesive joints on aluminum
作者： Jie Chen , Yulan Wen
DOI: 10.1109/ICEPT.2016.7583121
关键词: Adhesive 、 Shear force 、 Microwave 、 Soldering 、 Materials science 、 Electrical conductor 、 Melting point 、 Composite material 、 Substrate (electronics) 、 Contact resistance
摘要: Conductive adhesive became solid at low temperature compared with Pb/Sn solder melting point. It was used as micro-interconnection material for those sensitive components. In this paper, experiments were conducted to characterize conductive joints microwave frequency. A switch attached on aluminum substrate by adhesive. The tests shear force and isolation evaluated in constant humidity 45°C 90% RH 1000h. Micro-cracks appeared the interface between a long time test. Shear decreased 2.35MPa after 100h test inclined 1.2MPa 1000h finished. Moisture went micro-cracks contact resistance of increased. Isolation rapidly first 200h steady afterwards accordance is only half beginning 6.5GHz. By contrast substrate, gold coated interconnect. 5% 6.5GHz
sci-hub.se 参考文章(8)
Yi Li, Daniel Lu, C. P. Wong, Isotropically Conductive Adhesives (ICAs) Electrical Conductive Adhesives with Nanotechnologies. pp. 121- 225 ,(2010) , 10.1007/978-0-387-88783-8_4
E.H. Wong, K.C. Chan, R. Rajoo, T.B. Lim, The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging electronic components and technology conference. pp. 576- 580 ,(2000) , 10.1109/ECTC.2000.853216
Yong-Sung Eom, Keonsoo Jang, Jong-Tae Moon, Jae-Do Nam, Jong-Min Kim, Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder Microelectronic Engineering. ,vol. 85, pp. 2202- 2206 ,(2008) , 10.1016/J.MEE.2008.05.038
Yi Li, C.P. Wong, Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications Materials Science & Engineering R-reports. ,vol. 51, pp. 1- 35 ,(2006) , 10.1016/J.MSER.2006.01.001
P. Nemeth, Accelerated life time test methods for new package technologies international spring seminar on electronics technology. pp. 215- 219 ,(2001) , 10.1109/ISSE.2001.931061
J. Liu, K. Gustafsson, Z. Lai, C. Li, Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. ,vol. 20, pp. 21- 30 ,(1997) , 10.1109/95.558540
YC Chan, KC Hung, CW Tang, CML Wu, None, Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431). pp. 141- 146 ,(2000) , 10.1109/ADHES.2000.860588
R. Dudek, H. Berek, T. Fritsch, B. Michel, Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism IEEE Transactions on Components and Packaging Technologies. ,vol. 23, pp. 462- 469 ,(2000) , 10.1109/6144.868845