Optimizing annealing steps for crystalline silicon solar cells with screen printed front side metallization and an oxide‐passivated rear surface with local contacts

作者: S. Kontermann , A. Wolf , D. Reinwand , A. Grohe , D. Biro

DOI: 10.1002/PIP.919

关键词: Carrier lifetimePassivationThermal oxidationAnnealing (metallurgy)Crystalline siliconOptoelectronicsAluminiumMaterials scienceSiliconWaferElectrical engineering

摘要: Silicon solar cells that feature screen printed front contacts and a passivated rear surface with local allow higher efficiencies compared to present industrial exhibit full area side metallization. If thermal oxidation is used for the passivation, final annealing step in processing sequence crucial. On one hand, this post-metallization (PMA) required decreasing recombination velocity (SRV) at aluminum-coated oxide-passivated surface. other PMA can negatively affect metallization leading lower fill factor. This work separately analyzes impact of on both, Measuring dark illuminated IV-curves standard aluminum back field (Al-BSF) silicon reveals metallization, while measuring effective minority carrier lifetime symmetric samples provides information about SRV. One-dimensional simulations are predicting cell performance according contributions from oxide-passivation different temperatures durations. The simulation also includes contacts. An optimized process presented experimentally verified. applied an Efficiencies up 18.1% achieved 148.8 cm2 Czochralski (Cz) wafers. Copyright © 2009 John Wiley & Sons, Ltd.

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