Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips
作者： Yaojun Chen , Bo Jing , Jianfeng Li , Xiaoxuan Jiao , Jiaxing Hu
DOI: 10.1109/TCPMT.2020.3040757
关键词: Random vibration 、 Stress (mechanics) 、 Failure mode and effects analysis 、 Soldering 、 Ball grid array 、 Fracture mechanics 、 Vibration 、 Composite material 、 Materials science 、 Joint (geology)
摘要: In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for was established based on life data. And vulnerable parts analyzed. First, conducted. Second, a lognormal distribution by means data analyzed fracture mechanics theory. Finally, chip discussed. Failure characteristics at different positions compared mode joint discussed using result observation with scanning electron microscope (SEM). The results show that each single follows logarithmic normal under vibration. Solder balls located four outermost corners are subjected to greatest stress, which weakest chips. Cracks generated near package side emerged from edge intermetallic compound (IMC) layer largest curvature.
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