FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints

摘要: Solder joint lifetime predictions are typically based on FE simulation to determine the load joints and then an empirical equation derive expected lifetime. In this paper authors presented a test vehicle for testing of solder results that were obtained by temperature cycling, including prediction models created experimental results. The is ceramic substrate with four joints. It has very simple geometry well-suited analysis. board two-layer PCB traces 4-wire resistance measurements. was measured in regular intervals mean lifetimes extracted observed failures fitting Weibull-equation maximum likelihood estimator. Two solders used soldering PCB: eutectic tin-lead tin-silver-copper solder. Temperature-shock tests performed different conditions. Based these results, coefficients two most common models, Coffin-Manson creep strain energy density approach, determined. logarithmic standard deviation quantify error from models.