Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints
作者： Bjorn Bohme , Mike Rollig , Steffen Wiese , Klaus-Jurgen Wolter
关键词: Metallurgy 、 Temperature cycling 、 Soldering 、 Ceramic 、 Finite element method 、 Materials science 、 Electrical measurements 、 Composite material 、 Fracture mechanics 、 Chip 、 Joint (geology)
摘要: This paper presents the results of thermo-mechanical lifetime tests. A novel test vehicle was employed to characterize solder joint reliability miniaturized lead-free tin-silver-copper bumps. The consists a stiff ceramic chip (AI2O3) with four corner joints assembled on FR-4 PWB. distance between centers is variable (d= 800/1600/2400/3200 mum). allows creating strain amplitudes in by applying one temperature load profile. built up thin film technology for an equal UBM (under bump metallurgy) each interface. influence different pad finishes investigated. Four-wire resistance measurement control electrical failure single joint. During TCTs (temperature cycling tests) variation characteristic parameters (DeltaT, f, dT/dt) bumps measured and detected failures were fitted Weibull equation. Additional measurements cross-sections analyzed regular intervals determine intermetallics formation, grain sizes crack propagation. Based experimental FEM simulation stressed geometry, coefficients Coffin-Manson-equation determined.
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