Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

摘要: Many investigations in lead-free solder-bumps on real components have been done with more or less successful lifetime prediction. Thermo-mechanical loads during temperature cycle test e.g. -40/spl deg/ to +125/spl deg/C the solder materials weaken thru time independent and dependent plastically deformation. Solder bumps underneath packages usually chip interposer are not only stressed by shear forces but also tensile force z-direction. The collected data may match studied component very well, is it possible transfer other electronic packages?.