Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
作者： Rainer Dudek , Sven Rzepka , Stephan Dobritz , Ralf Doring , Kerstin Keybig
关键词:
摘要: Currently, various mainly tin-based lead free solders are in use or under evaluation. Many solder fatigue models have been developed to predict the life of joints low-cycle conditions, however, because diversity solders, more work is needed this respect. The theoretical prediction joints, based upon non-linear finite element (FE-) calculation results, requires both a constitutive model and Coffin-Manson type failure criterion, if an engineering evaluation chosen. material investigated was near-eutectic SnAgCu with lower silver content, i. e. Sn98.5Ag1Cu0.5, which one choice currently discussed. Properties like creep resistance but better brittle performance combined cost can make SnAg1Cu0.5 candidate for broader application. study deals material. A special wafer level test package (WLP) used derived on experimentally observed data compared FE results. In FEA effects input quantities scatter, different types mesh densities, analysis codes studied general averaging strategy, be criterions ball interconnects, proposed.
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