Electronic component assembly
作者： James A. Zollo , Lonnie L. Bernardoni , Kenneth R. Thompson
DOI:
关键词: Electronic component 、 Solder ball 、 Optoelectronics 、 Stacking 、 Printed circuit board 、 Materials science
摘要: A stackable surface mount electronic component assembly 100 allowing for the stacking of components 108, and 112 is disclosed. The includes carriers 102, 114, each having an respectively. two are electrically interconnected by use solder balls 106. Electronic carrier 114 in turn attached to external printed circuit board 110. Optionally, can be encapsulated using encapsulation material prior joining 114. In alternate embodiment recesses 302 located on top elevated peripheral edge 116 proper alignment
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