Stacked via structure for metal fuse applications
作者： Naftali E. Lustig , Ronald G. Filippi , Andrew H. Simon , Kaushik Chanda , Griselda Bonilla
DOI:
关键词: Optoelectronics 、 Structural engineering 、 Stacking 、 Stack (abstract data type) 、 Line (electrical engineering) 、 Fuse (electrical) 、 Dielectric 、 Engineering 、 Electromigration
摘要: A back end of the line (BEOL) fuse structure having a stack vias. The stacking vias leads to high aspect ratios making liner and seed coverage inside poorer. weakness layers higher probability electromigration (EM) failure. addresses failures due poor coverage. Design features permit determining where occur, extent damaged region after programming preventing further propagation dielectric region.
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