Chemical solution application apparatus and chemical solution application method
作者： Fuminori Tateishi
DOI:
关键词: Point (geometry) 、 Substrate (printing) 、 Viscosity 、 Mechanical engineering 、 Nozzle 、 Materials science 、 Spin coating 、 Discharging method 、 Chemical solution 、 Coating
摘要: An object is to provide a chemical solution application apparatus capable of applying evenly and without irregularity by spin coating method. A plurality nozzles are provided for an that fixed over stage. Each the individually mobile in vertical horizontal directions. For this reason, controlling discharging point or pattern possible, responding wider viscosity range solutions possible. By implementing present invention, equipped with method which film having small thickness distribution entire substrate even can be obtained, as well use efficiency improved cutting down on waste discharged.
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