3-D Vertical Dual-Layer Oxide Memristive Devices

作者:

DOI: 10.1109/TED.2014.2319814

关键词: OxideElectrical engineeringMemristorLithographyMaterials scienceResistive random-access memoryPlanarElectrodeNeuromorphic engineeringOptoelectronicsTungsten

摘要: Dual-layer resistive switching memory devices with WO x layer formed at the sidewall of horizontal electrodes have been fabricated and characterized. The exhibit well-characterized analog characteristics small mismatch in electrical for two layers. 3-D vertical device structure allows higher storage density larger connectivity neuromorphic computing applications. We show that potentiation depression similar to planar devices, can be programmed independently no crosstalk between

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