Method of purging and passivating a semiconductor processing chamber
作者： Aihua Chen , Robert A. Chapman
DOI:
关键词: Metallurgy 、 Passivation 、 Nitrogen 、 Semiconductor 、 Integrated circuit 、 Chemistry 、 Vacuum chamber 、 Wafer 、 Argon gas 、 Waste management
摘要: A method for purging and passivating a vacuum chamber suitable use in the production of integrated circuit structures on semiconductor wafers. The includes flowing heated, non-reactive gas, such as argon through purposes decontaminating subsequently filling with selected gas nitrogen to passivate storage or shipping purposes.
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