Laminating magnetic cores for on-chip magnetic devices
作者： Lubomyr T. Romankiw , Philipp Herget , William J. Gallagher , Bucknell C. Webb , Eugene J. O'Sullivan
DOI:
关键词: Magnetic layer 、 Optoelectronics 、 Nuclear magnetic resonance 、 Materials science
摘要: A laminating structure includes a first magnetic layer, second spacer disposed between the and layers on layer.
lens.org 参考文章(23)
Yongbong Han, Serdar Aksu, Bulent M. Basol, Selenium electroplating chemistries and methods ,(2008)
Donald F. Canaperi, Lubomyr T. Romakiw, Mahadevaiyer Krishnan, Sol Krongelb, David L. Rath, Inductive head lamination with layer of magnetic quenching material ,(1990)
Raman Vaidyanathan, Hariklia Deligianni, Lubomyr T. Romankiw, Forming a Photovoltaic Device ,(2009)
Ebrahim Andideh, Arnel M. Fajardo, Patrick Morrow, Changmin Park, Laminating magnetic materials in a semiconductor device ,(2006)
J.C. Slonczewski, B. Petek, B.E. Argyle, Micromagnetics of laminated Permalloy films IEEE Transactions on Magnetics. ,vol. 24, pp. 2045- 2054 ,(1988) , 10.1109/20.3399
Iris Nandhakumar, Joanne M. Elliott, George S. Attard, Electrodeposition of Nanostructured Mesoporous Selenium Films (HI-eSe) Chemistry of Materials. ,vol. 13, pp. 3840- 3842 ,(2001) , 10.1021/CM010484D
A. K. Graham, H. L. Pinkerton, H. J. Boyd, Electrodeposition of Amorphous Selenium Journal of The Electrochemical Society. ,vol. 106, pp. 651- 654 ,(1959) , 10.1149/1.2427465
Tawab Dastagir, Wei Xu, Saurabh Sinha, Hao Wu, Yu Cao, Hongbin Yu, Tuning the permeability of permalloy films for on-chip inductor applications Applied Physics Letters. ,vol. 97, pp. 162506- ,(2010) , 10.1063/1.3502478
M. G. Armutlulu, A., Fang, Y., Kim, S. H., Ji, C. H., Allen, S. B., & Allen, A MEMS-enabled 3D zinc–air microbattery with improved discharge characteristics based on a multilayer metallic substructure Journal of Micromechanics and Microengineering. ,vol. 21, pp. 104011- ,(2011) , 10.1088/0960-1317/21/10/104011
Jörg Schulze, Ulrike Engelhardt, Torsten Voss, Bernd Fröse, Aylin Sönmez, Andreas Kirbs, Heiko Brunner, Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (ib)-group 13 (iiia)-group 16 (via) ,(2009)