Laminating magnetic materials in a semiconductor device
作者： Ebrahim Andideh , Arnel M. Fajardo , Patrick Morrow , Changmin Park
DOI:
关键词:
摘要: A technique includes forming overlaying magnetic metal layers over a semiconductor substrate. The at least one resistance layer between the layers.
lens.org 参考文章(6)
Akihiro Odagawa, Masayoshi Hiramoto, Kenji Iijima, Hiroshi Sakakima, Nozomu Matukawa, Magneto-resistive element ,(2001)
Joffre F. Bernard, Dawn M. Hopper, Minh Van Ngo, Dielectric treatment in integrated circuit interconnects ,(2001)
Peter Moon, Valery Dubin, Method for forming electroless metal low resistivity interconnects ,(2003)
Nobuya Oyama, Tsutomu Koyanagi, Makoto Yoshida, Yoshitaka Sasaki, Inverted hybrid thin film magnetic head and method of manufacturing the same ,(1998)
Dong-Chul Yoo, Dong-Hyun Im, Ji-Eun Lim, Myung-Gon Kim, Byoung Bae, Ferroelectric structures and devices including upper/lower electrodes of different metals and methods of forming the same ,(2005)