New insulating particleboards prepared from mixture of solid wastes from tissue paper manufacturing and corn peel.

作者: Pranee Lertsutthiwong , Srichalai Khunthon , Krisana Siralertmukul , Khanittha Noomun , Suwalee Chandrkrachang

DOI: 10.1016/J.BIORTECH.2007.09.051

关键词: ConductivityWaste managementPolystyreneThermal conductivityComposite numberTissue paperMunicipal solid wasteLaminationComposite materialMaterials scienceSwelling

摘要: New composite boards with low-thermal conductivity produced from a mixture of solid wastes tissue paper manufacturing (solid waste TPM) and corn peel have been developed. The effects TPM/corn ratio on the properties were investigated possibility using recycled polystyrene packaging foam as laminating agent to improve quality was also evaluated. Our results show that density particleboards decrease increasing amount added in mixture, leading thermal final product. In contrary, larger TPM stronger boards. lamination surface improves mechanical reduces thickness swelling best improvement resistance could be achieved when 15% (w/v) coated

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