Method and device for substrate treatment
作者： Kengo Mizosaki , Kiyohisa Tateyama , Hideyuki Takamori , Noriyuki Anai , 清久 立山
DOI:
关键词: Substrate (printing) 、 Composite material 、 Inert gas 、 Line width 、 Materials science 、 Resist
摘要: PROBLEM TO BE SOLVED: To provide a method and device for treating substrate, wherein transfer which is an index of unevenness in the thickness resist film fluctuations line width circuit pattern prevented. SOLUTION: For exposure process development with substrate on liquid coated, coated G, then G substantially dried under no-heating heat. As specific example, inert gas. Is blown from showerhead 82 dried.
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