SUBSTRATE TREATMENT EQUIPMENT, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC INSTRUMENT
作者： Ito Yoshitake
DOI:
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摘要: PROBLEM TO BE SOLVED: To make it possible to footprint of whole equipment small by improving miniaturization without problems caused from device configuration flexibility in an making minimum unit the into block configuration. SOLUTION: The includes: treatment parts arranging 21 23 which are constituted a plurality parts, perform predetermined substrate G be treated, one direction; first transporting mechanism is provided and transports treated; second mechanisms 11 15 outside part fixed on approximately extension direction or orthogonal or/and movable line parallel direction, so as freely transfer treated directly indirectly mechanism. COPYRIGHT: (C)2008,JPO&INPIT
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