HEAT TREATMENT, HEAT TREATMENT EQUIPMENT AND TREATMENT SYSTEM

作者: Mizutani Yoji , Nagashima Shinji , Yonemizu Akira

DOI:

关键词: Jet (fluid)Gas concentrationWaferSubstrate (printing)Composite materialTreatment systemCoatingTreatment unitInert gasMaterials science

摘要: PROBLEM TO BE SOLVED: To treat by heating a substrate while an oxidation of coating liquid is restrained method wherein gas concentration in atmosphere for heat-treating the controlled to heat-treat substrate, coated with which oxidized at high temperature. SOLUTION: A treatment equipment constituted into such structure that heat plate 31 treating wafer arranged almost center unit, hot wires, example, are buried this 31. When treated heating, temperature surface set so as become 400 deg.C or thereabouts, example. N2 jet pipes 34 on periphery way encircle 31, multitude holes 35 provided these and jetted within unit through 35. Further, it possible use other inert gas, Ar instead gas.

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