Principles of Microelectromechanical Systems

摘要: PREFACE. 1 INTRODUCTION. 1.1 Microelectromechanical Systems. 1.2 Coupled 1.3 Knowledge Required. 1.4 Dimensional Analysis. Problems. 2 MICROFABRICATION. 2.1 Bulk and Surface Micromachining. 2.2 Lithography. 2.3 Layer Deposition. 2.4 Etching. 2.5 Fabrication Process Design. 3 STATICS. 3.1 Static Equilibrium. 3.2 Stress-Strain Relationship. 3.3 Thermal Stress. 3.4 Beam Behavior Subjected to a Torsional Moment. 3.5 Moment-Curvature 3.6 Equation. 3.7 Galerkin's Method. 3.8 Energy 3.9 Method for 4 STATIC BEHAVIOR OF MICROSTRUCTURES. 4.1 Elements of Microstructures. 4.2 Stiffness Commonly Used Beams. 4.3 Trusses. 4.4 Transformation. 4.5 Planar Structures. 4.6 Residual 4.7 Cubic Force 4.8 Potential Energy. 4.9 Analogy Between Energies. 5 DYNAMICS. 5.1 5.2 Description Motion. 5.3 Governing Equations Dynamics. 5.4 Conversion Kinetic 5.5 Free Vibration Undamped 5.6 Damped 5.7 Multidegree-of-freedom systems. 5.8 Continuous 5.9 Effective Mass, Damping, Stiffness. 5.10 Systems with Repeated 5.11 Duffi ng's 6 FLUID 6.1 Viscous Flow. 6.2 Continuity 6.3 Navier-Stokes 6.4 Reynolds 6.5 Couette 6.6 Oscillating Plate in Fluid. 6.7 Creeping 6.8 Squeeze Film. 7 ELECTROMAGNETICS. 7.1 Basic Electric Circuits. 7.2 Kirchhoff's Circuit Laws. 7.3 Electrostatics. 7.4 Moment Due an Field. 7.5 Electrostatic Forces Moments Acting on Various Objects / 395 7.6 Electromagnetic 410 7.7 Moving Charge Magnetic Fields 418 7.8 Piezoresistance. 7.9 Piezoelectricity. 8 PIEZOELECTRIC AND THERMAL ACTUATORS. 8.1 Composite 8.2 Piezoelectric Actuators. 8.3 9 ELECTROSTATIC ELECTROMAGNETIC 9.1 9.2 Comb Drive Actuator. 9.3 Parallel-Plate 9.4 9.5 Fixed-Fixed 9.6 Cantilever 9.7 Dynamic Response Gap-Closing 9.8 Approximation 9.9 10 SENSORS. 10.1 Pressure Sensors. 10.2 Accelerometers. 10.3 10.4 Vibratory Gyroscopes. 10.5 Other Issues. APPENDIX. REFERENCES. INDEX.