作者: Victor Boureau , Daniel Benoit , Bénédicte Warot , Martin Hÿtch , Alain Claverie
DOI: 10.1016/J.MSSP.2015.07.034
关键词: Materials science 、 Silicon on insulator 、 Fabrication 、 Buried oxide 、 Optoelectronics 、 Electron holography 、 Crystallography 、 Insulator (electricity) 、 Lattice (order)
摘要: We study the interplay between strain and composition during elementary process steps which allow fabrication of strained ultra-thin SiGe layers on insulators from a Silicon-On-Insulator (SOI) substrate by Ge condensation technique. Strain maps with subnanometer resolution high precision are obtained using dark-field electron holography confirm that two basic mechanisms drive final top layer, namely injection oxidation Si/Ge interdiffusion, both thermally activated. show this observed results out-of-plane relaxation stress generated substitution Si atoms in lattice, rigidly bounded to underlying buried oxide.