Electropolishing assembly and methods for electropolishing conductive layers
作者： Voha Nuch , Peihaur Yih , Felix Gutman , Hui Wang , Muhammed Afnan
DOI:
关键词: Optoelectronics 、 Wafer backgrinding 、 Wafer dicing 、 Shroud 、 Electronic engineering 、 Edge (geometry) 、 Electropolishing 、 Materials science 、 Nozzle 、 Wafer 、 Electrical conductor
摘要: In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on wafer (1004). An includes chuck (1002) holding wafer, actuator (1000) rotating chuck, nozzle (1010) configured to electropolish wafer. The may further include ring or shroud (1006). A with sufficient speed such that electrolyte fluid incident upon flows surface towards edge
lens.org 参考文章(10)
Uri Cohen, George Tzanavaras, Precision high rate electroplating cell and method ,(1993)
Joseph J. Stevens, Michael N. Sugarman, Yezdi N. Dordi, Method and associated apparatus for tilting a substrate upon entry for metal deposition ,(2001)
Madhav Datta, Lubomyr Taras Romankiw, Electrochemical tool for uniform metal removal during electropolishing ,(1992)
Hugo A. E. Santini, Daniel F. O'Kane, Johannes Grandia, Rotary electroplating cell with controlled current distribution ,(1980)
Hui Wang, Method and apparatus for end-point detection ,(2001)
Terrence R. O'Toole, Madhav Datta, Electrochemical metal removal technique for planarization of surfaces ,(1994)
Christian Schmid, Apparatus for treating panel-type objects, especially circuit boards ,(1992)
Kunal N. Taravade, Apparatus and method for blocking the deposition of oxide on a wafer ,(1998)