作者: Masami Tachikawa , Hidefumi Mori
DOI: 10.1063/1.102951
关键词: Dislocation 、 Composite material 、 Vapor phase 、 Etching (microfabrication) 、 Mineralogy 、 Materials science 、 Stage (hydrology) 、 Etch pit density
摘要: In situ measurements are carried out for the etch pit density (EPD) of GaAs on Si at growth temperature using a newly developed HCl‐GaCL vapor phase etching method. The EPD obtained is 4×104 cm−2 temperature. However, after cools down to room temperature, 8×106 molten KOH etching. GaP also out, and almost same result obtained; that around 107 dislocations generated in cooling stage. This first evidence thermal stress stage determines quality heteroepitaxial layers Si.