Dislocation generation of GaAs on Si in the cooling stage

作者: Masami Tachikawa , Hidefumi Mori

DOI: 10.1063/1.102951

关键词: DislocationComposite materialVapor phaseEtching (microfabrication)MineralogyMaterials scienceStage (hydrology)Etch pit density

摘要: In situ measurements are carried out for the etch pit density (EPD) of GaAs on Si at growth temperature using a newly developed HCl‐GaCL vapor phase etching method. The EPD obtained is 4×104 cm−2 temperature. However, after cools down to room temperature, 8×106 molten KOH etching. GaP also out, and almost same result obtained; that around 107 dislocations generated in cooling stage. This first evidence thermal stress stage determines quality heteroepitaxial layers Si.

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