Modeling of reactively sputtered TiAlN films
作者： Ding-Fwu Lii , Jow-Lay Huang , Bor-Yuan Shew
DOI: 10.1016/S0040-6090(98)00969-9
关键词: High-speed steel 、 Volumetric flow rate 、 Chemical engineering 、 Nitrogen 、 Metallurgy 、 Sputtering 、 Physical vapor deposition 、 Sticking coefficient 、 Materials science 、 Deposition (phase transition) 、 Nitride
摘要: Abstract Multi-component nitride TiAlN films were deposited on high speed steel substrate through the reactive sputtering process. A model was successfully developed for simulating deposition of TiAlN. By following this rate and coverage fraction at various nitrogen rates sticking coefficient species simulated. The simulated different flow current are in good agreement with experimental results. stoichiometric coating formed critical no obvious compositional changes observed further increase rate. reaction kinetics Ti Al used to account optimum properties relatively
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