Joining of Si3N4/Si3N4 with CuNiTiB paste brazing filler metals and interfacial reactions of the joints
作者： Chuangeng Wan , Huaping Xiong , Zhenfeng Zhou
关键词: Joint (geology) 、 Titanium alloy 、 Filler (packaging) 、 Metallurgy 、 Scanning electron microscope 、 Microstructure 、 Fracture (geology) 、 Materials science 、 Flexural strength 、 Brazing
摘要: The joining of Si3N4/Si3N4 was carried out using CuNiTiB paste brazing filler metals. maximum room-temperature three-point bend strength the joints is 338.8 MPa. cross-section microstructures and element area distribution were examined by scanning electron microscope (SEM) equipped with wave dispersive X-ray spectroscopy (WDS). phases appeared on fracture surfaces determined means diffraction analysis (XRDA) method. A model established interfacial reactions between Si3N4 With this model, relationship joint discussed.
springer.com
sci-hub.se 参考文章(9)
Kazuyoshi Saida, Yoshikuni Nakao, Kazutoshi Nishimoto, Bonding of Si_3N_4 to Metals with Active Filler Metals Transactions of the Japan Welding Society. ,vol. 20, pp. 66- 76 ,(1989)
Masaaki Naka, Ikuo Okamoto, Tasuku Tanaka, Joining of Silicon Nitride Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability) Transactions of JWRI. ,vol. 16, pp. 83- 90 ,(1987)
P. M. Scott, M. Nicholas, B. Dewar, The wetting and bonding of diamonds by copper-base binary alloys Journal of Materials Science. ,vol. 10, pp. 1833- 1840 ,(1975) , 10.1007/BF00754470
Ronald E. Loehman, Antoni P. Tomsia, Joseph A. Pask, Sylvia M. Johnson, Bonding Mechanisms in Silicon Nitride Brazing Journal of the American Ceramic Society. ,vol. 73, pp. 552- 558 ,(1990) , 10.1111/J.1151-2916.1990.TB06552.X
T Nishino, S Urai, I Okamoto, M Naka, Wetting and reaction products formed at interface between SiC and Cu‐Ti alloys Welding International. ,vol. 6, pp. 600- 605 ,(1991) , 10.1080/09507119209548249
A. -P. Xian, Z. -Y. Si, Joining of Si3N4 using Ag57Cu38Ti5 brazing filler metal Journal of Materials Science. ,vol. 25, pp. 4483- 4487 ,(1990) , 10.1007/BF00581112
D. H. Kim, S. H. Hwang, S. S. Chun, The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys Journal of Materials Science. ,vol. 26, pp. 3223- 3234 ,(1991) , 10.1007/BF01124666
W. X. Pan, T. Okamoto, X. S. Ning, Joining of Al-plasma-sprayed Si3N4ceramics Journal of Materials Science. ,vol. 29, pp. 1436- 1440 ,(1994) , 10.1007/BF00368906
A. P. Tomsia, R. E. Loehman, Joining of ceramics American Ceramic Society Bulletin. ,vol. 67, pp. 375- 380 ,(1988)