The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys

摘要: The wettability and reactivity of pressureless sintered Si3N4 by powdered Cu-Ti alloy were investigated using sessile drop tests conducted in a vacuum. Bonding to itself was also carried out joint strength evaluated compressive shear testing. correlation wetting behaviour with reaction bond interpreted. alloys on improved greatly addition titanium up 50 wt%. However, the reaction-layer thickness increased 10 wt% thereafter decreased We propose dovetail model which describes growth titanium. As content increased, it tended form continuous thin layer wettability. From metallographic XRD analyses, TiN Ti suicide found layer. thermodynamic for formation suggested be Si3N4(s) + 4Ti (1 − sol) = 4TiN(s) 3Si(s). Ti-silicide might formed during cooling Si had been decomposed from Si3N4, diffused dissolved liquid Cu-rich alloy. controlled diffusion nitrogen or according concentration. affected morphology rather than rapidly 5 then slowly temperature time lowered due greater despite