Design for manufacturability in submicron domain
作者： W. Maly , H. Heineken , J. Khare , P. K. Nag
关键词: Die (integrated circuit) 、 Integrated circuit design 、 Domain (software engineering) 、 Process (engineering) 、 Circuit design 、 Manufacturing engineering 、 Physical design 、 Engineering 、 Reliability engineering 、 Design for manufacturability 、 Interface (Java)
摘要: … Both affect area and critical area and hence yield and manufacturability. Unfortunately, while a number of prediction tools are available to estimate area and delay from an RTL data flow…
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sci-hub.st 参考文章(40)
K. P. Wang, Layout design for yield and reliability 5th ACM SIGDA Physical Design Workshop. ,(1996)
Wojciech Maly, Jitendra B. Khare, From Contamination to Defects, Faults and Yield Loss: Simulation and Applications ,(1996)
W. Maly, C. Ouyang, S. Ghosh, S. Maturi, Detection of an antenna effect in VLSI designs defect and fault tolerance in vlsi and nanotechnology systems. pp. 86- 94 ,(1996) , 10.1109/DFTVS.1996.571999
J. Khare, W. Maly, Inductive contamination analysis (ICA) with SRAM application international test conference. pp. 552- 560 ,(1995) , 10.1109/TEST.1995.529883
A. J. Strojwas, Design for Manufacturability and Yield design automation conference. pp. 454- 459 ,(1989) , 10.1145/74382.74458
W. Maly, Computer-aided design for VLSI circuit manufacturability Proceedings of the IEEE. ,vol. 78, pp. 356- 392 ,(1990) , 10.1109/5.52217
W. Maly, J. Deszczka, Yield estimation model for VLSI artwork evaluation Electronics Letters. ,vol. 19, pp. 226- 227 ,(1983) , 10.1049/EL:19830156
W. Maly, Future of testing: Reintegration of design, testing and manufacturing european design and test conference. ,(1996) , 10.1109/EDTC.1996.494116
W. Maly, Modeling of Lithography Related Yield Losses for CAD of VLSI Circuits IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 4, pp. 166- 177 ,(1985) , 10.1109/TCAD.1985.1270112
A.V. Ferris-Prabhu, Role of defect size distribution in yield modeling IEEE Transactions on Electron Devices. ,vol. 32, pp. 1727- 1736 ,(1985) , 10.1109/T-ED.1985.22187