Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding
作者： Fengtian Hu , Shan Yang , Haozhe Wang , Anmin Hu , Ming Li
DOI: 10.1007/S11664-015-3930-2
关键词: Thermocompression bonding 、 Silver coating 、 Metallurgy 、 Layer (electronics) 、 Composite material 、 Shear strength 、 Materials science 、 Copper 、 Solid-state physics 、 Soldering 、 Oxide 、 Electrical and Electronic Engineering 、 Materials Chemistry 、 Electronic, Optical and Magnetic Materials 、 Condensed matter physics
摘要: … Figure 4 shows the copper oxide film thickness for the different electroless plated silver coatings … When the thickness of the silver plated layer reached 0.35 lm, the rate of increase of the …
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H.T. Lee, Y.H. Lee, Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints ☆ Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 419, pp. 172- 180 ,(2006) , 10.1016/J.MSEA.2005.12.021
Eun-Jung Jang, Seungmin Hyun, Hak-Joo Lee, Young-Bae Park, Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages Journal of Electronic Materials. ,vol. 38, pp. 2449- 2454 ,(2009) , 10.1007/S11664-009-0942-9
Wenyan Geng, Zhuo Chen, Anmin Hu, Ming Li, Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array Materials Letters. ,vol. 78, pp. 72- 74 ,(2012) , 10.1016/J.MATLET.2012.03.027
Wenjing Zhang, Zheyin Yu, Zhuo Chen, Ming Li, Preparation of super-hydrophobic Cu/Ni coating with micro-nano hierarchical structure Materials Letters. ,vol. 67, pp. 327- 330 ,(2012) , 10.1016/J.MATLET.2011.09.114
Jongsung Kim, Chin C. Lee, Fluxless Sn–Ag bonding in vacuum using electroplated layers Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 448, pp. 345- 350 ,(2007) , 10.1016/J.MSEA.2006.10.160
M. Sánchez, J. Rams, A. Ureña, Oxidation Mechanisms of Copper and Nickel Coated Carbon Fibers Oxidation of Metals. ,vol. 69, pp. 327- 341 ,(2008) , 10.1007/S11085-008-9100-7
Brian F. Dyson, Diffusion of Gold and Silver in Tin Single Crystals Journal of Applied Physics. ,vol. 37, pp. 2375- 2377 ,(1966) , 10.1063/1.1708821
Riko I Made, Chee Lip Gan, Liling Yan, Katherine Hwee Boon Kor, Hong Ling Chia, Kin Leong Pey, Carl V. Thompson, Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits Acta Materialia. ,vol. 60, pp. 578- 587 ,(2012) , 10.1016/J.ACTAMAT.2011.09.038
Cheng-Ta Ko, Kuan-Neng Chen, Low temperature bonding technology for 3D integration Microelectronics Reliability. ,vol. 52, pp. 302- 311 ,(2012) , 10.1016/J.MICROREL.2011.03.038
Ken Suzuki, Satoru Kano, Masanori Kajihara, Noriharu Kurokawa, Katsuhiko Sakamoto, Reactive Diffusion between Ag and Sn at Solid State Temperatures Materials Transactions. ,vol. 46, pp. 969- 973 ,(2005) , 10.2320/MATERTRANS.46.969