Sintering Of Hybrid Nano Sliver Paste Achieve Cone-Structured Cu Bonding in die attachment

摘要: In this paper, towards to the problem existed in sintering of nano sliver paste used electronic packaging devices, we take corresponding measures and achieved very good results. Nano silver paste, because its low-temperature characteristics, is generally considered as a substitute for lead-free solder high temperature applications. There still exist some serious sintered die attachment, which limit application production. For example, porosity voids, poor wettability at interfaces, decrease thermal electrical conductivity mechanical strength join, breaks often occur interface between copper silver. We adopt electroless plating method growing cones on copper, surface morphology were characterized by Scanning Electron Microscope. Copper cone structure increase contact with particle forming interlock. improve reduce plus low melting point material tin prepare hybrid paste. This study aims address these issues concentrates microstructural characterizations attachment. Experiment shows that, Cu together had an remarkable bonding bring technology much closer practical use power