Joining the connection wires of semiconductor systems to the carrier elements
作者： Lothar Schuller , Gerhard Dipl.-Phys. Rauscher , Oscar Wirbser , Reinhold Dipl.-Phys. Penzl , Hans-Jürgen Dipl.-Ing. Hacke
DOI:
关键词: Electronic engineering 、 Laser 、 Joint (geology) 、 Connection (principal bundle) 、 Base (geometry) 、 Radiation 、 Evaporation (deposition) 、 Materials science 、 Optoelectronics 、 Chip 、 Semiconductor
摘要: Laser light is used to thermocompression bond the connection wires of semiconductor components base surfaces carrier materials with relatively low chip temperature. Three methods are primarily suitable for this purpose: heating joint focused laser radiation next joint, until a flat molten zone produced or evaporation surface at material shortly before bonding operation.
lens.org 参考文章(1)
Johnson Clair Allen, Hot gas thermo-compression bonding ,(1963)