Wire bonding technique for integrated circuit chips

摘要: Title of the Invention LEAD FRAME WIRE BONDING BY PREHEATING Abstract Disclosure In a method for welding lead wire or bonding from microcircuit chip mounted on frame to finger, finger is preheated prior any substantial electrical thermal coupling between and chip. Intense but controlled energy applied at levels which might otherwise damage IC one embodiment temperature below melting point metal comprising frame. Enhanced thereafter effected by thermocompression like. another preheating step comprises portion surface forming molten pool puddle in surface. Bonding affected immersing section puddle. order preheat pulse train delivered arc discharge location. apparatus circuitry performing are described.