Investigation and improvement of reversible microfluidic devices based on glass–PDMS–glass sandwich configuration

摘要: Reversibly assembled microfluidic devices are dismountable and reusable, which is useful for a number of applications such as micro- nano-device fabrication, surface functionalization, complex cell patterning, other biological analysis by means spatial–temporal pattern. However, reversible fabricated with current standard procedures can only be used low-pressure applications. Assembling technology based on glass–PDMS–glass sandwich configuration provides an alternative sealing method devices, drastically increase the strength reversibly adhered devices. The improvement mechanism properties technique has not been fully characterized, hindering further broad use this technique. Here, we characterize, first time, effect various parameters PDMS/glass hybrid including contact area, PDMS thickness, assembling mode, external force. To improve propose new scheme exploits mechanical clamping elements to reinforce structures. Using our scheme, microchips survive pressure up 400 kPa, comparable irreversibly bonded microdevices. We believe that bonding may find in lab-on-a-chip particularly active high-pressure-driven