作者: Li-Min Hung , Chia-Hua Chu , Yao-Te Huang , Jung-Huei Peng , Nien-Tsung Tsai
DOI:
关键词: Electrical engineering 、 Materials science 、 Microelectromechanical systems 、 Optoelectronics 、 Mechanical system 、 Electrical conductor 、 Dielectric 、 Substrate (printing) 、 Block (telecommunications)
摘要: Some embodiments of the present disclosure provide a microelectromechanical systems (MEMS). The MEMS includes semiconductive block. block protruding structure. structure bottom surface. sensing A substrate conductive region. region first surface under is substantially coplanar with dielectric second not disposed over