Micro-electro-mechanical system and manufacturing method thereof

作者: Li-Min Hung , Chia-Hua Chu , Yao-Te Huang , Jung-Huei Peng , Nien-Tsung Tsai

DOI:

关键词: Electrical engineeringMaterials scienceMicroelectromechanical systemsOptoelectronicsMechanical systemElectrical conductorDielectricSubstrate (printing)Block (telecommunications)

摘要: Some embodiments of the present disclosure provide a microelectromechanical systems (MEMS). The MEMS includes semiconductive block. block protruding structure. structure bottom surface. sensing A substrate conductive region. region first surface under is substantially coplanar with dielectric second not disposed over

参考文章(14)
Ming-Ching Wu, Su-Jhen Lin, Micro-electromechanical system (mems) carrier ,(2014)
Chen-Chih Fan, Bruce C. S. Chou, Chang-Chia Chang, MEMS device structure and methods of forming same ,(2012)
Chia-Pao Shu, Chia-Ming Hung, Wen-Chuan Tai, Hsiang-Fu Chen, Hung-Sen Wang, Alex Kalnitsky, Micro-electro mechanical system (mems) structures and methods of forming the same ,(2014)
Hsueh-An Yang, Chun-Wen Cheng, Bond ring for a first and second substrate ,(2010)
Yuan-Chih Hsieh, Richard Chu, Chia-Shiung Tsai, Lan-Lin Chao, Hung Hua Lin, Chun-Wen Cheng, Jung-Huei Peng, Hsin-Ting Huang, Martin Liu, Wafer level packaging bond ,(2010)
Yvonne Bergmann, Jochen Reinmuth, Jens Frey, Method for manufacturing a component having an electrical through-connection ,(2013)
Chia-Pao Shu, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Structure and method for motion sensor ,(2012)
Daniel Christoph Meisel, Mirko Hattass, Johannes Classen, Micromechanical inertial sensor and method for manufacturing same ,(2013)
Chaorui Liang, Xieshen Xie, Hongzhou Wang, Zongting Yuan, Zhengzhang Li, Huangkun Chen, Taigang Xing, Chaoqing Wang, Capacitance type sensing structure ,(2008)