Structural and magnetic characterization of electrodeposited Ni/Cu multilayers

作者: S.K. Ghosh , S. Singh , S. Basu

DOI: 10.1016/J.MATCHEMPHYS.2009.10.046

关键词: Materials scienceMagnetoresistanceElectrolyteAnalytical chemistryCrystallographyNickelSubstrate (electronics)Magnetic momentMagnetizationNeutron reflectometryScatteringGeneral Materials ScienceCondensed matter physics

摘要: Abstract Ni/Cu multilayers were electrodeposited from a single solution electrolyte by galvanostatic method. Interface roughness, magnetization and magneto-transport studies of on Si(1 1 1)/Ti/Cu substrate carried out for samples deposited three different electrolytes, viz. pure sulphate, sulphate–citrate sulphate-polyethylene glycol-8000 (PEG-8000). The top Ni-layer morphology these was characterized atomic force microscope (AFM). Detailed analysis the morphological data showed typical two-dimensional fractal growth pattern in all cases. structural parameters like interface density thicknesses Ni Cu layers extracted neutron reflectivity (NR) study. order roughness obtained NR AFM found to be quite close. sample have minimum roughness. polarized reflectometry (PNR) measurement reduced magnetic moment value (∼0.41 ± 0.01 μB) nickel compared bulk samples. magnetoresistance (MR) measured at room temperature. An attempt has been made explain observed MR results terms granular structure scattering mechanism involving super-paramagnetic ferromagnetic particles

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